NeoCut Plus front_new (shape)

LASER cutting, based on the Osai innovating LASER Cut Technology, which can perform clean and safe cutting without producing dust and mechanical stress on the electronic components. LASER depanelling is the best way to obtain rapid cutting (cutting times reduced by up to 70% compared with traditional methods) and flexible cutting (cutting of PCB junctions or complete PCBs with a thickness of up to 3 mm for the basic version).