Laser Depaneling for FR4 and flexible PCBs

NeoCut Easy is the solution for Laser cutting of electronic boards. Unlike mechanical depaneling processes (conventional router and blade), Laser cutting is the only process that produces no mechanical stress on the board or its components, thus eliminating the risk of cracks on them. Moreover, it is a process that generates no residue.

The wide range of available Laser sources (CO2, UV and green) allows the cutting of both rigid boards (FR4) and flexible boards (kapton).

The creation of recipes (cutting programmes) can be done manually: the machine screen displays the image of the board, on which the cutting lines can be ‘drawn’. Alternatively, for greater positioning accuracy, the DXF file of the board can be imported to define the cutting points.

We are available for your questions or suggestions.
Please fill out the form below.

Laser Source
CO2
Fiber
Green

Working Area
480 x 480 mm

DXF
programming

SMEMA
interface

Laser Depaneling for FR4 and flexible PCBs

NeoCut Easy is the solution for Laser cutting of electronic boards. Unlike mechanical depaneling processes (conventional router and blade), Laser cutting is the only process that produces no mechanical stress on the board or its components, thus eliminating the risk of cracks on them. Moreover, it is a process that generates no residue.

The wide range of available Laser sources (CO2, UV and green) allows the cutting of both rigid boards (FR4) and flexible boards (kapton).

The creation of recipes (cutting programmes) can be done manually: the machine screen displays the image of the board, on which the cutting lines can be ‘drawn’. Alternatively, for greater positioning accuracy, the DXF file of the board can be imported to define the cutting points.

We are available for your questions or suggestions.
Please fill out the form below.

Laser Source
CO2
Fiber
Green

Working Area
480 x 480 mm

DXF
programming

SMEMA
interface