Solutions for Power Devices Production
Power Module Assembly Line is an investment for the future. Osai experience in semiconductor application automation can make the mass production easy, reliable and 100% human error free.
This equipment is used to assemble different parts of power modules such as dice, lead frame, preform, and plastic case.
Suitable for: Dice, Preform, AMB, Lead Frame, Plastic Case
Configurable Input Media: Tray, Blister, Tape & Reel, Bulk, Film Frame
High Accuracy: ±5ym
High Speed: Up to 1sec/cycle
This equipment is used to place the pins of the substrate. It works for both wired (inserted) and coil pins (punched and soldered in the next phase)
Suitable for: Wired Pins and Coil Pins
High Accuracy: ±5ym
Pin Insertion Check: Height ±50ym, Force Control up to 500N
High Speed: Up to 2pins/s
Optical Features: Single Pin Optical Alignement, 3D Scan Check
This equipment can be configured with: glue, flux jet dispenser (with integrated optical check and UV curing) or SilGel dispenser (teo components volumetric dispenser) with vacuum potting chamber
Suitable for: Ultra Fast Jet Dispensing/Two Components Volumetric Dispensing
Designed for: Flux, Glue, SilGel
High Accuracy: ±5ym
Optical Features: UV Lighting Vision System, Long Life LED UV Curing
High Speed: Up to 300PH
Additional Features: Vacuum Potting Chamber, Weight Check
According to the connection method, the equipment can be configured to perform Vacuum induction soldering or ultrasonic welding
Suitable for: Lead Frame Welding / Pin Soldering
High Accuracy: ±5ym
Top Notch Technology: Linear or Torsional Ultrasonic Welding, Patented Vacuum Induction Soldering
Optical Features: Full Optical Alignement, Quality Optical Inspection
This equipment is used to mark every single leadframe/AMB, and device, to allow each single unit traceability. The green Laser sources is the ultimate solution for a fast, and accurate marking on copper, silver, ceramic substrate and plastic case
LASER: Green
Fiducial Check: For accurate marking position
100% Data and Grading Check: On 1d/2d code
Optical Check: For component presence/absence
Full Library: 2D code, Bar code, QR code and others
Tailored DB Communication: For traceability
Standard/customized automation solution
Power modules packages compliant
High productivity
for mass production
Complete monolithic production lines
Built-in Predictive maintenance
AGV
ready
Secs-GEM
ready
Solutions for Power Devices Production
Power Module Assembly Line is an investment for the future. Osai experience in semiconductor application automation can make the mass production easy, reliable and 100% human error free.
This equipment is used to assemble different parts of power modules such as dice, lead frame, preform, and plastic case.
Suitable for: Dice, Preform, AMB, Lead Frame, Plastic Case
Configurable Input Media: Tray, Blister, Tape & Reel, Bulk, Film Frame
High Accuracy: ±5ym
High Speed: Up to 1sec/cycle
This equipment is used to place the pins of the substrate. It works for both wired (inserted) and coil pins (punched and soldered in the next phase)
Suitable for: Wired Pins and Coil Pins
High Accuracy: ±5ym
Pin Insertion Check: Height ±50ym, Force Control up to 500N
High Speed: Up to 2pins/s
Optical Features: Single Pin Optical Alignement, 3D Scan Check
This equipment can be configured with: glue, flux jet dispenser (with integrated optical check and UV curing) or SilGel dispenser (teo components volumetric dispenser) with vacuum potting chamber
Suitable for: Ultra Fast Jet Dispensing/Two Components Volumetric Dispensing
Designed for: Flux, Glue, SilGel
High Accuracy: ±5ym
Optical Features: UV Lighting Vision System, Long Life LED UV Curing
High Speed: Up to 300PH
Additional Features: Vacuum Potting Chamber, Weight Check
According to the connection method, the equipment can be configured to perform Vacuum induction soldering or ultrasonic welding
Suitable for: Lead Frame Welding / Pin Soldering
High Accuracy: ±5ym
Top Notch Technology: Linear or Torsional Ultrasonic Welding, Patented Vacuum Induction Soldering
Optical Features: Full Optical Alignement, Quality Optical Inspection
This equipment is used to mark every single leadframe/AMB, and device, to allow each single unit traceability. The green Laser sources is the ultimate solution for a fast, and accurate marking on copper, silver, ceramic substrate and plastic case
LASER: Green
Fiducial Check: For accurate marking position
100% Data and Grading Check: On 1d/2d code
Optical Check: For component presence/absence
Full Library: 2D code, Bar code, QR code and others
Tailored DB Communication: For traceability
Standard/customized automation solution
Power modules packages compliant
High productivity
for mass production
Complete monolithic production lines
Built-in Predictive maintenance
AGV
ready
Secs-GEM
ready
