Multi‑Station Discrete Test Handler for TPAK Power MOSFETs

The NeoDTH is a high‑performance multi‑station discrete test handler engineered to meet the most demanding requirements of power semiconductor testing. Specifically designed for TPAK Power MOSFETs, it delivers advanced thermal testing capabilities, high throughput up to 2,700 units per hour, and seamless integration into modern automated factories. A robust and flexible platform built for automotive, industrial, and power electronics applications where quality, reliability, and productivity are critical.

True power device validation occurs under real operating conditions.

The NeoDTH is designed to perform accurate, stable, and repeatable thermal tests, ensuring the reliable characterization of Power MOSFETs throughout the production process. The system supports programmable thermal soak up at temperatures of up to 175°C, with an accuracy of ±3°C, and features active temperature control at each test station. An optional nitrogen atmosphere provides additional protection for the device during high-temperature testing. This makes the NeoDTH ideal for high‑temperature electrical testing, stress validation, and corner‑lot verification.

The result is superior correlation with real‑world operating conditions and consistent, reliable product quality.

This test solution has been developed with one clear focus: to maximize performance when testing TPAK Power MOSFETs. Every detail, from device handling to electrical contact and thermal management, has been optimized to ensure safe handling, stable electrical contact, even at elevated temperatures, and consistent, repeatable test results over time.

In addition to TPAK, the platform supports a wide range of power discrete packages, including T‑MAX, TO264 and TO247 (in both 3‑lead and 4‑lead versions), TO220, TO263 and D3PAK, as well as similar form factors. Dedicated conversion kits enable swift adaptation to different package types and input/output media requirements.

High Throughput with MultiStation Architecture

At the heart of the NeoDTH lies a 16‑position, high‑speed turret, which is combined with a true multi‑station architecture. The system can manage up to six independent test stations, enabling parallel testing and significantly increasing throughput without compromising test accuracy.

Designed for continuous production, the DTH ensures stable, reliable operation and minimizes downtime, keeping production running smoothly. The result is increased uptime and optimized overall equipment efficiency.

We are available for your questions or suggestions.
Please fill out the form below.

Turret system
16 position high speed turret

Diagnostic
Step by Step funtion for troubleshooting purpose

Jam Rate
≤ 1/10000

MTBF
≥ 1680 hours

MTTA
≤ 3 minutes for hard jam

Conversion time between packages
≤ 15 mins

Input and Output media
Tube, Trays (JEDEC or Custom), Conveyor (in line config)

Bin Media
Trays (JEDEC or Custom) ,Tube (up to 12), Bin Boxes

Unit traceability
Device DMC reading

Soak capability
Programmable temperature up to 175°C(± 3°C), N2 atmosphere (optional)

Test stations
Up to 6 test stations with active temperature control system

High Voltage test
Pressurized test contactor chamber up to 4 Bar (option)

High speed Visual Inspection
Lead VI inspection, 5s or 6s VI (optional), CU Oxidation VI (optional)

Tester integration
ATE direct or soft docking capability

Tester interface
GPIB,TTL/IO,TCP/IP,RS232

Factory integration
Secs/Gem, STULT interface

ESD applied standard
IEC 61340-5-1 – 61340-2-3 – 61340-4-7

ESD class
Class 0 open loop, Class 0 closed loop (optional)

Clean room compliance
ISO6 compliant

Supported device packages (*)
TPAK,T-MAX,TO264,TO247-4L,TO247-3L,TO220,TO263,D3PAK, and similar

Factory automation ready
Robotization and AGV ready

(*): Required specific conversion kit according to the package type and input/output media requirements.

Multi‑Station Discrete Test Handler for TPAK Power MOSFETs

The NeoDTH is a high‑performance multi‑station discrete test handler engineered to meet the most demanding requirements of power semiconductor testing. Specifically designed for TPAK Power MOSFETs, it delivers advanced thermal testing capabilities, high throughput up to 2,700 units per hour, and seamless integration into modern automated factories. A robust and flexible platform built for automotive, industrial, and power electronics applications where quality, reliability, and productivity are critical.

True power device validation occurs under real operating conditions.

The NeoDTH is designed to perform accurate, stable, and repeatable thermal tests, ensuring the reliable characterization of Power MOSFETs throughout the production process. The system supports programmable thermal soak up at temperatures of up to 175°C, with an accuracy of ±3°C, and features active temperature control at each test station. An optional nitrogen atmosphere provides additional protection for the device during high-temperature testing. This makes the NeoDTH ideal for high‑temperature electrical testing, stress validation, and corner‑lot verification.

The result is superior correlation with real‑world operating conditions and consistent, reliable product quality.

This test solution has been developed with one clear focus: to maximize performance when testing TPAK Power MOSFETs. Every detail, from device handling to electrical contact and thermal management, has been optimized to ensure safe handling, stable electrical contact, even at elevated temperatures, and consistent, repeatable test results over time.

In addition to TPAK, the platform supports a wide range of power discrete packages, including T‑MAX, TO264 and TO247 (in both 3‑lead and 4‑lead versions), TO220, TO263 and D3PAK, as well as similar form factors. Dedicated conversion kits enable swift adaptation to different package types and input/output media requirements.

High Throughput with MultiStation Architecture

At the heart of the NeoDTH lies a 16‑position, high‑speed turret, which is combined with a true multi‑station architecture. The system can manage up to six independent test stations, enabling parallel testing and significantly increasing throughput without compromising test accuracy.

Designed for continuous production, the DTH ensures stable, reliable operation and minimizes downtime, keeping production running smoothly. The result is increased uptime and optimized overall equipment efficiency.

We are available for your questions or suggestions.
Please fill out the form below.

Turret system
16 position high speed turret

Diagnostic
Step by Step funtion for troubleshooting purpose

Jam Rate
≤ 1/10000

MTBF
≥ 1680 hours

MTTA
≤ 3 minutes for hard jam

Conversion time between packages
≤ 15 mins

Input and Output media
Tube, Trays (JEDEC or Custom), Conveyor (in line config)

Bin Media
Trays (JEDEC or Custom) ,Tube (up to 12), Bin Boxes

Unit traceability
Device DMC reading

Soak capability
Programmable temperature up to 175°C(± 3°C), N2 atmosphere (optional)

Test stations
Up to 6 test stations with active temperature control system

High Voltage test
Pressurized test contactor chamber up to 4 Bar (option)

High speed Visual Inspection
Lead VI inspection, 5s or 6s VI (optional), CU Oxidation VI (optional)

Tester integration
ATE direct or soft docking capability

Tester interface
GPIB,TTL/IO,TCP/IP,RS232

Factory integration
Secs/Gem, STULT interface

ESD applied standard
IEC 61340-5-1 – 61340-2-3 – 61340-4-7

ESD class
Class 0 open loop, Class 0 closed loop (optional)

Clean room compliance
ISO6 compliant

Supported device packages (*)
TPAK,T-MAX,TO264,TO247-4L,TO247-3L,TO220,TO263,D3PAK, and similar

Factory automation ready
Robotization and AGV ready

(*): Required specific conversion kit according to the package type and input/output media requirements.