SMT Hybrid Packaging 2015

//SMT Hybrid Packaging 2015

SMT Hybrid Packaging 2015

The SMT Hybrid Packaging is the most important event dedicated to the system integration in microelectronics.
International suppliers of SMT equipment, devices and services will meet to exchange solutions and ideas during conferences and tutorials to provide you with information on the electronic component manufacturing in Europe.
The Osai Automation Systems exhibition team thanks all its visitors for pleasant conversations and look forward to the next event.
2017-03-20T17:03:31+00:00 By |